| Lapisan | 1-2 Lapisan |
| Réngsé Kandel | 16-134mil (0.4mm-3.4mm) |
| Max. Diménsi | 500mm * 1200mm |
| Ketebalan tambaga | 35um, 70um,1 nepi ka 10oZ |
| Min Line Width / Spasi | 4 mil (0,1 mm) |
| Min Réngsé Ukuran liang | 0,95 mm |
| Min. Ukuran Bor | 1.00mm |
| Max. Ukuran Bor | 6,5 mm |
| Réngsé Toléransi Ukuran liang | ± 0,050 mm |
| Aperture Posisi Precision | ± 0,076 mm |
| Min SMT PAD Ukuran | 0.4mm ± 0.1mm |
| Min.Solder Topeng PAD | 0.05mm (2 mil) |
| Min.Solder Topeng Panutup | 0.05mm (2 mil) |
| Ketebalan topeng Solder | > 12um |
| Permukaan Finishing | HAL, HAL Lead bébas, OSP, Immersion Gold, jsb |
| HAL Ketebalan | 5-12um |
| Immersion Emas Ketebalan | 1-3mil |
| Kandel Film OSP | ENTEK PLUS HT: 0.3-0.5um; F2: 0.15-0.3um |
| Outline Finishing | Routing & punching; Precision simpangan ± 0.10mm |
| Konduktivitas termal | 1.0 nepi ka 12w/mk |
| Pelabuhan FOB | Shenzhen |
| Ékspor Karton Diménsi L / W / H | 36 x 26 x 25 Cm |
| Waktos prosés | 3-7 poé |
| Unit per Karton Ékspor | 5.0 |
| Ékspor Carton Beurat | 18 kg |